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| Features * High-density, High-performance, Electrically-erasable Complex Programmable Logic Device - 3.0 to 3.6V Operating Range - 64 Macrocells - 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell - 44, 68, 84, 100 Pins - 15 ns Maximum Pin-to-pin Delay - Registered Operation up to 77 MHz - Enhanced Routing Resources In-System Programmability (ISP) via JTAG Flexible Logic Macrocell - D/T/Latch Configurable Flip-flops - Global and Individual Register Control Signals - Global and Individual Output Enable - Programmable Output Slew Rate - Programmable Output Open-collector Option - Maximum Logic Utilization by Burying a Register with a COM Output Advanced Power Management Features - Automatic 5 A Standby for "L" Version - Pin-controlled 100 A Standby Mode (Typical) - Programmable Pin-keeper Circuits on Inputs and I/Os - Reduced-power Feature per Macrocell Available in Commercial and Industrial Temperature Ranges Available in 44-, 68-, and 84-lead PLCC; 44- and 100-lead TQFP; and 100-lead PQFP Advanced EE Technology - 100% Tested - Completely Reprogrammable - 10,000 Program/Erase Cycles - 20 Year Data Retention - 2000V ESD Protection - 200 mA Latch-up Immunity JTAG Boundary-scan Testing to IEEE Std. 1149.1-1990 and 1149.1a-1993 Supported PCI-compliant Security Fuse Feature * * Low-voltage, Complex Programmable Logic Device ATF1504ASV ATF1504ASVL * * * * * * * Enhanced Features * * * * * * * * * * * Improved Connectivity (Additional Feedback Routing, Alternate Input Routing) Output Enable Product Terms Transparent-latch Mode Combinatorial Output with Registered Feedback within Any Macrocell Three Global Clock Pins ITD (Input Transition Detection) Circuits on Global Clocks, Inputs and I/O Fast Registered Input from Product Term Programmable "Pin-keeper" Option VCC Power-up Reset Option Pull-up Option on JTAG Pins TMS and TDI Advanced Power Management Features - Edge-controlled Power-down "L" - Individual Macrocell Power Option - Disable ITD on Global Clocks, Inputs and I/O Rev. 1409I-PLD-2/03 1 44-lead TQFP Top View I/O I/O I/O VCC GCLK2/OE2/I GCLR/I I/OE1 GCLK1/I GND GCLK3/I/O I/O 44-lead PLCC Top View I/O I/O I/O VCC GCLK2/OE2/I GCLR/I OE1/I GCLK1/I GND GCLK3/I/O I/O 33 32 31 30 29 28 27 26 25 24 23 I/O I/O/TDO I/O I/O VCC I/O I/O I/O/TCK I/O GND I/O 44 43 42 41 40 39 38 37 36 35 34 I/O/TDI I/O I/O GND PD1/I/O I/O TMS/I/O I/O VCC I/O I/O 1 2 3 4 5 6 7 8 9 10 11 I/O I/O I/O I/O GND VCC I/O PD2/I/O I/O I/O I/O 68-lead PLCC Top View I/O I/O I/O GND I/O I/O VCCINT GCLK2/OE2/I GCLR/I OE1/I GCLK1/I GND GCLK3/I/O I/O VCCIO I/O I/O 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 I/O I/O I/O I/O VCCIO I/O I/O GND VCCINT I/O I/O/PD2 GND I/O I/O I/O I/O VCCIO 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 I/O VCCIO I/O/TD1 I/O I/O I/O GND I/O/PD1 I/O I/O/TMS I/O VCCIO I/O I/O I/O I/O GND 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 I/O I/O GND I/O/TDO I/O I/O I/O VCCIO I/O I/O I/O/TCK I/O GND I/O I/O I/O I/O 2 ATF1504ASV(L) 1409I-PLD-2/03 I/O I/O I/O I/O I/O VCCIO I/O I/O I/O GND VCCINT I/O I/O I/O/PD2 GND I/O I/O I/O I/O I/O VCCIO 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 I/O VCCIO I/O/TDI I/O I/O I/O I/O GND I/O/PD1 I/O I/O I/O/TMS I/O I/O VCCIO I/O I/O I/O I/O I/O GND 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 11 10 9 8 7 6 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75 I/O I/O I/O I/O GND I/O I/O I/O VCCINT GCLK2/OE2/I I/GCLR I/OE1 GCLK1/I GND GCLK3/I/O I/O I/O VCCIO 1/O I/O I/O 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 I/O I/O GND I/O/TDO I/O I/O I/O I/O VCCIO I/O I/O I/O I/O/TCK I/O I/O GND I/O I/O I/O I/O I/O I/O I/O I/O I/O GND VCC I/O PD2/I/O I/O I/O I/O 12 13 14 15 16 17 18 19 20 21 22 18 19 20 21 22 23 24 25 26 27 28 TDI/I/O I/O I/O GND PD1/I/O I/O I/O/TMS I/O VCC I/O I/O 7 8 9 10 11 12 13 14 15 16 17 6 5 4 3 2 1 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 I/O I/O/TDO I/O I/O VCC I/O I/O I/O/TCK I/O GND I/O 84-lead PLCC Top View ATF1504ASV(L) 100-lead PQFP Top View I/O I/O I/O GND I/O I/O I/O VCCINT INPUT/OE2/GCLK2 INPUT/GCLR INPUT/OE1 INPUT/GCLK1 GND I/O/GCLK3 I/O I/O VCCIO I/O I/O I/O 100-lead TQFP Top View I/O I/O I/O I/O I/O GND I/O I/O I/O VCCINT INPUT/OE2/GCLK2 INPUT/GCLR INPUT/OE1 INPUT/GCLK1 GND I/O/GCLK3 I/O I/O VCCIO I/O I/O I/O NC NC I/O NC NC VCCIO I/O/TDI NC I/O NC I/O I/O I/O GND I/O/PD1 I/O I/O I/O/TMS I/O I/O VCCIO I/O I/O I/O NC I/O NC I/O 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 NC NC I/O I/O VCCIO I/O/TDI NC I/O NC I/O I/O I/O GND I/O/PD1 I/O I/O I/O/TMS I/O I/O VCCIO I/O I/O I/O NC I/O NC I/O GND NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 NC NC I/O I/O GND I/O/TDO NC I/O NC I/O I/O I/O VCCIO I/O I/O I/O I/O/TCK I/O I/O GND I/O I/O I/O NC I/O NC I/O VCCIO NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 I/O GND I/O/TDO NC I/O NC I/O I/O I/O VCCIO I/O I/O I/O I/O/TCK I/O I/O GND I/O I/O I/O NC I/O NC I/O VCCIO I/O I/O I/O I/O I/O VCCIO I/O I/O I/O GND VCCINT I/O I/O I/O/PD2 GND I/O I/O I/O I/O I/O GND NC NC I/O I/O I/O I/O I/O VCCIO I/O I/O I/O GND VCCINT I/O I/O I/O/PD2 GND I/O I/O I/O I/O I/O NC NC 3 1409I-PLD-2/03 Description The ATF1504ASV(L) is a high-performance, high-density complex programmable logic device (CPLD) that utilizes Atmel's proven electrically-erasable memory technology. With 64 logic macrocells and up to 68 inputs, it easily integrates logic from several TTL, SSI, MSI, LSI and classic PLDs. The ATF1504ASV(L)'s enhanced routing switch matrices increase usable gate count and the odds of successful pin-locked design modifications. The ATF1504ASV(L) has up to 68 bi-directional I/O pins and four dedicated input pins, depending on the type of device package selected. Each dedicated pin can also serve as a global control signal, register clock, register reset or output enable. Each of these control signals can be selected for use individually within each macrocell. Each of the 64 macrocells generates a buried feedback that goes to the global bus. Each input and I/O pin also feeds into the global bus. The switch matrix in each logic block then selects 40 individual signals from the global bus. Each macrocell also generates a foldback logic term that goes to a regional bus. Cascade logic between macrocells in the ATF1504ASV(L) allows fast, efficient generation of complex logic functions. The ATF1504ASV(L) contains four such logic chains, each capable of creating sum term logic with a fan-in of up to 40 product terms. The ATF1504ASV(L) macrocell, shown in Figure 1, is flexible enough to support highlycomplex logic functions operating at high speed. The macrocell consists of five sections: product terms and product term select multiplexer, OR/XOR/CASCADE logic, a flip-flop, output select and enable, and logic array inputs. 4 ATF1504ASV(L) 1409I-PLD-2/03 ATF1504ASV(L) Block Diagram Unused product terms are automatically disabled by the compiler to decrease power consumption. A security fuse, when programmed, protects the contents of the ATF1504ASV(L). Two bytes (16 bits) of User Signature are accessible to the user for purposes such as storing project name, part number, revision or date. The User Signature is accessible regardless of the state of the security fuse. The ATF1504ASV(L) device is an in-system programmable (ISP) device. It uses the industry-standard 4-pin JTAG interface (IEEE Std. 1149.1), and is fully-compliant with JTAG's Boundary-scan Description Language (BSDL). ISP allows the device to be programmed without removing it from the printed circuit board. In addition to simplifying the manufacturing flow, ISP also allows design modifications to be made in the field via software. Product Terms and Select Mux Each ATF1504ASV(L) macrocell has five product terms. Each product term receives as its inputs all signals from both the global bus and regional bus. The product term select multiplexer (PTMUX) allocates the five product terms as needed to the macrocell logic gates and control signals. The PTMUX programming is determined by the design compiler, which selects the optimum macrocell configuration. 5 1409I-PLD-2/03 OR/XOR/CASCADE Logic The ATF1504ASV(L)'s logic structure is designed to efficiently support all types of logic. Within a single macrocell, all the product terms can be routed to the OR gate, creating a 5-input AND/OR sum term. With the addition of the CASIN from neighboring macrocells, this can be expanded to as many as 40 product terms with little additional delay. The macrocell's XOR gate allows efficient implementation of compare and arithmetic functions. One input to the XOR comes from the OR sum term. The other XOR input can be a product term or a fixed high- or low-level. For combinatorial outputs, the fixed level input allows polarity selection. For registered functions, the fixed levels allow DeMorgan minimization of product terms. The XOR gate is also used to emulate T- and JK-type flip-flops. Flip-flop The ATF1504ASV(L)'s flip-flop has very flexible data and control functions. The data input can come from either the XOR gate, from a separate product term or directly from the I/O pin. Selecting the separate product term allows creation of a buried registered feedback within a combinatorial output macrocell. (This feature is automatically implemented by the fitter software). In addition to D, T, JK and SR operation, the flip-flop can also be configured as a flow-through latch. In this mode, data passes through when the clock is high and is latched when the clock is low. The clock itself can either be one of the Global CLK Signal (GCK[0 : 2]) or an individual product term. The flip-flop changes state on the clock's rising edge. When the GCK signal is used as the clock, one of the macrocell product terms can be selected as a clock enable. When the clock enable function is active and the enable signal (product term) is low, all clock edges are ignored. The flip-flop's asynchronous reset signal (AR) can be either the Global Clear (GCLEAR), a product term, or always off. AR can also be a logic OR of GCLEAR with a product term. The asynchronous preset (AP) can be a product term or always off. Extra Feedback The ATF1504ASV(L) macrocell output can be selected as registered or combinatorial. The extra buried feedback signal can be either combinatorial or a registered signal regardless of whether the output is combinatorial or registered. (This enhancement function is automatically implemented by the fitter software.) Feedback of a buried combinatorial output allows the creation of a second latch within a macrocell. The output enable multiplexer (MOE) controls the output enable signal. Each I/O can be individually configured as an input, output or for bi-directional operation. The output enable for each macrocell can be selected from the true or compliment of the two output enable pins, a subset of the I/O pins, or a subset of the I/O macrocells. This selection is automatically done by the fitter software when the I/O is configured as an input, all macrocell resources are still available, including the buried feedback, expander and cascade logic. The global bus contains all input and I/O pin signals as well as the buried feedback signal from all 64 macrocells. The switch matrix in each logic block receives as its inputs all signals from the global bus. Under software control, up to 40 of these signals can be selected as inputs to the logic block. Each macrocell also generates a foldback product term. This signal goes to the regional bus and is available to four macrocells. The foldback is an inverse polarity of one of the macrocell's product terms. The four foldback terms in each region allow generation of high fan-in sum terms (up to nine product terms) with little additional delay. I/O Control Global Bus/Switch Matrix Foldback Bus 6 ATF1504ASV(L) 1409I-PLD-2/03 ATF1504ASV(L) Figure 1. ATF1504ASV(L) Macrocell Programmable Pin-keeper Option for Inputs and I/Os The ATF1504ASV(L) offers the option of programming all input and I/O pins so that pin keeper circuits can be utilized. When any pin is driven high or low and then subsequently left floating, it will stay at that previous high- or low-level. This circuitry prevents unused input and I/O lines from floating to intermediate voltage levels, which causes unnecessary power consumption and system noise. The keeper circuits eliminate the need for external pull-up resistors and eliminate their DC power consumption. 7 1409I-PLD-2/03 Input Diagram I/O Diagram Speed/Power Management The ATF1504ASV(L) has several built-in speed and power management features. The ATF1504ASV(L) contains circuitry that automatically puts the device into a low power standby mode when no logic transitions are occurring. This not only reduces power consumption during inactive periods, but also provides proportional power savings for most applications running at system speeds below 5 MHz. This feature may be selected as a device option. To further reduce power, each ATF1504ASV(L) macrocell has a reduced-power bit feature. This feature allows individual macrocells to be configured for maximum power savings. This feature may be selected as a design option. All ATF1504ASV(L) also have an optional power-down mode. In this mode, current drops to below 5 mA. When the power-down option is selected, either PD1 or PD2 pins (or both) can be used to power down the part. The power-down option is selected in the design source file. When enabled, the device goes into power down when either PD1 or PD2 is high. In the power-down mode, all internal logic signals are latched and held, as are any enabled outputs. All pin transitions are ignored until the PD pin is brought low. When the power-down feature is enabled, the PD1 or PD2 pin cannot be used as a logic input or output. However, the pin's macrocell may still be used to generate buried foldback and cascade logic signals. 8 ATF1504ASV(L) 1409I-PLD-2/03 ATF1504ASV(L) All power-down AC characteristic parameters are computed from external input or I/O pins, with reduced-power bit turned on. For macrocells in reduced-power mode (reduced-power bit turned on), the reduced-power adder, tRPA, must be added to the AC parameters, which include the data paths tLAD, tLAC, tIC, tACL, tACH and tSEXP. The ATF1504ASV(L) macrocell also has an option whereby the power can be reduced on a per macrocell basis. By enabling this power-down option, macrocells that are not used in an application can be turned down, thereby reducing the overall power consumption of the device. Each output also has individual slew rate control. This may be used to reduce system noise by slowing down outputs that do not need to operate at maximum speed. Outputs default to slow switching, and may be specified as fast switching in the design file. Design Software Support Power-up Reset ATF1504ASV(L) designs are supported by several industry standard third party tools. Automated fitters allow logic synthesis using a variety of high-level description languages and formats. The ATF1504ASV is designed with a power-up reset, a feature critical for state machine initialization. At a point delayed slightly from VCC crossing VRST, all registers will be initialized, and the state of each output will depend on the polarity of its buffer. However, due to the asynchronous nature of reset and uncertainty of how VCC actually rises in the system, the following conditions are required: 1. The VCC rise must be monotonic, 2. After reset occurs, all input and feedback setup times must be met before driving the clock pin high, and, 3. The clock must remain stable during TD. The ATF1504ASV has two options for the hysteresis about the reset level, VRST, Small and Large. To ensure a robust operating environment in applications where the device is operated near 3.0V, Atmel recommends that during the fitting process users configure the device with the Power-up Reset hysteresis set to Large. For conversions, Atmel POF2JED users should include the flag "-power_reset" on the command line after "filename.POF". To allow the registers to be properly reinitialized with the Large hysteresis option selected, the following condition is added: 4. If VCC falls below 2.0V, it must shut off completely before the device is turned on again. When the Large hysteresis option is active, ICC is reduced by several hundred microamps as well. Security Fuse Usage A single fuse is provided to prevent unauthorized copying of the ATF1504ASV(L) fuse patterns. Once programmed, fuse verify is inhibited. However, the 16-bit User Signature remains accessible. 9 1409I-PLD-2/03 Programming ATF1504ASV(L) devices are in-system programmable (ISP) devices utilizing the 4-pin JTAG protocol. This capability eliminates package handling normally required for programming and facilitates rapid design iterations and field changes. A t m el pr o v i d es IS P ha r dw a r e a n d s o ft w a r e t o a l l o w p r o g r a m m i n g of t h e ATF1504ASV(L) via the PC. ISP is performed by using either a download cable, a comparable board tester or a simple microprocessor interface. To facilitate ISP programming by the Automated Test Equipment (ATE) vendors. Serial Vector Format (SVF) files can be created by Atmel provided software utilities. ATF1504ASV(L) devices can also be programmed using standard third-party programmers. With third-party programmer the JTAG ISP port can be disabled thereby allowing four additional I/O pins to be used for logic. Contact your local Atmel representatives or Atmel PLD applications for details. ISP Programming Protection The ATF1504ASV(L) has a special feature that locks the device and prevents the inputs and I/O from driving if the programming process is interrupted for any reason. The inputs and I/O default to high-Z state during such a condition. In addition the pin keeper option preserves the former state during device programming, if this circuit were previously programmed on the device. This prevents disturbing the operation of other circuits in the system while the ATF1504ASV(L) is being programmed via ISP. All ATF1504ASV(L) devices are initially shipped in the erased state thereby making them ready to use for ISP. Note: For more information refer to the "Designing for In-System Programmability with Atmel CPLDs" application note. 10 ATF1504ASV(L) 1409I-PLD-2/03 ATF1504ASV(L) DC and AC Operating Conditions Commercial Operating Temperature (Ambient)) VCC (3.3V) Power Supply 0C - 70C 3.0V - 3.6V Industrial -40C - 85C 3.0V - 3.6V DC Characteristics Symbol IIL IIH IOZ Parameter Input or I/O Low Leakage Current Input or I/O High Leakage Current Tri-State Output Off-State Current VO = VCC or GND Com. Std Mode ICC1 Power Supply Current, Standby VCC = Max VIN = 0, VCC "L" Mode Ind. ICC2 ICC3(2) VIL VIH Power Supply Current, Power-down Mode Reduced-power Mode Supply Current, Standby Input Low Voltage Input High Voltage Output Low Voltage (TTL) VOL Output Low Voltage (CMOS) Output High Voltage - 3.3V (TTL) VOH Output High Voltage - 3.3V (CMOS) VIN = VIH or VIL VCC = Min, IOL = 0.1 mA VIN = VIH or VIL VCCIO = Min, IOH = -2.0 mA VIN = VIH or VIL VCCIO = Min, IOH = -0.1 mA VIN = VIH or VIL VCCIO = Min, IOL = 8 mA Com. Ind. Com. Ind. 2.4 VCCIO - 0.2 VCC = Max VIN = 0, VCC VCC = Max VIN = 0, VCC "PD" Mode Com Std Power Ind -0.3 1.7 55 0.8 VCCIO + 0.3 0.45 0.45 0.2 0.2 V V V V V V V 5 0.1 40 5 A mA ma Ind. Com. 75 5 mA A -40 60 Condition VIN = VCC Min Typ -2 2 Max -10 10 40 A mA Units A Notes: 1. Not more than one output at a time should be shorted. Duration of short circuit test should not exceed 30 sec. 2. When microcell reduced-power feature is enabled. Pin Capacitance Typ CIN CI/O Max 8 8 Units pF pF Conditions VIN = 0V; f = 1.0 MHz VOUT = 0V; f = 1.0 MHz Note: Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested. The OGI pin (high-voltage pin during programming) has a maximum capacitance of 12 pF. 11 1409I-PLD-2/03 Absolute Maximum Ratings* Temperature Under Bias.................................. -40C to +85C Storage Temperature ..................................... -65C to +150C Voltage on Any Pin with Respect to Ground .........................................-2.0V to +7.0V(1) Voltage on Input Pins with Respect to Ground During Programming.....................................-2.0V to +14.0V(1) Note: Programming Voltage with Respect to Ground .......................................-2.0V to +14.0V(1) 1. *NOTICE: Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Minimum voltage is -0.6V DC, which may undershoot to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is VCC + 0.75V DC, which may overshoot to 7.0V for pulses of less than 20 ns. Timing Model Internal Output Enable Delay tIOE Global Control Delay tGLOB Logic Array Delay tLAD Register Control Delay tLAC tIC tEN Foldback Term Delay tSEXP Cascade Logic Delay tPEXP Input Delay tIN Switch Matrix tUIM Fast Input Delay tFIN Register Delay tSU tH tPRE tCLR tRD tCOMB tFSU tFH Output Delay tOD1 tOD2 tOD3 tXZ tZX1 tZX2 tZX3 I/O Delay tIO 12 ATF1504ASV(L) 1409I-PLD-2/03 ATF1504ASV(L) AC Characteristics -15 Symbol tPD1 tPD2 tSU tH tFSU tFH tCOP tCH tCL tASU tAH tACOP tACH tACL tCNT fCNT tACNT fACNT fMAX tIN tIO tFIN tSEXP tPEXP tLAD tLAC tIOE tOD1 tOD2 tOD3 tZX1 Parameter Input or Feedback to Non-Registered Output I/O Input or Feedback to Non-Registered Feedback Global Clock Setup Time Global Clock Hold Time Global Clock Setup Time of Fast Input Global Clock Hold Time of Fast Input Global Clock to Output Delay Global Clock High Time Global Clock Low Time Array Clock Setup Time Array Clock Hold Time Array Clock Output Delay Array Clock High Time Array Clock Low Time Minimum Clock Global Period Maximum Internal Global Clock Frequency Minimum Array Clock Period Maximum Internal Array Clock Frequency Maximum Clock Frequency Input Pad and Buffer Delay I/O Input Pad and Buffer Delay Fast Input Delay Foldback Term Delay Cascade Logic Delay Logic Array Delay Logic Control Delay Internal Output Enable Delay Output Buffer and Pad Delay (Slow slew rate = OFF; VCCIO = 5V; CL = 35 pF) Output Buffer and Pad Delay (Slow slew rate = OFF; VCCIO = 3.3V; CL = 35 pF) Output Buffer and Pad Delay (Slow slew rate = ON; VCCIO = 5V or 3.3V; CL = 35 pF) Output Buffer Enable Delay (Slow slew rate = OFF; VCCIO = 5.0V; CL = 35 pF) 76.9 100 2 2 2 8 1 6 3.5 3 3 3 5 7 76.9 13 58.8 83.3 2.5 2.5 2 10 1 8 4.5 3 4 4 6 9 6 6 13 66 17 5 5 5 4 15 8 8 17 Min 3 3 11 0 3 1.0 9 6 6 7 4 18.5 Max 15 12 13.5 0 3 2 12 Min -20 Max 20 16 Units ns ns ns ns ns MHz ns ns ns ns ns ns ns ns ns MHz ns MHz MHz ns ns ns ns ns ns ns ns ns ns ns ns 13 1409I-PLD-2/03 AC Characteristics (Continued) -15 Symbol tZX2 tZX3 tXZ tSU tH tFSU tFH tRD tCOMB tIC tEN tGLOB tPRE tCLR tUIM tRPA Notes: Parameter Output Buffer Enable Delay (Slow slew rate = OFF; VCCIO = 3.3V; CL = 35 pF) Output Buffer Enable Delay (Slow slew rate = ON; VCCIO = 5.0V/3.3V; CL = 35 pF) Output Buffer Disable Delay (CL = 5 pF) Register Setup Time Register Hold Time Register Setup Time of Fast Input Register Hold Time of Fast Input Register Delay Combinatorial Delay Array Clock Delay Register Enable Time Global Control Delay Register Preset Time Register Clear Time Switch Matrix Delay Reduced-power Adder (2) -20 Max 7 10 6 Min Max 9 11 7 6 5 2 2 2 2 6 6 2 4 4 2 10 2.5 3 7 7 3 5 5 2.5 13 Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Min 5 4 2 2 1. See ordering information for valid part numbers. 2. The tRPA parameter must be added to the tLAD, tLAC,tTIC, tACL, and tSEXP parameters for macrocells running in the reducedpower mode. 3. See ordering information for valid part numbers. Input Test Waveforms and Measurement Levels tR, tF = 1.5 ns typical Output AC Test Loads 3.0V R1 = 703 OUTPUT PIN R2 = 8060 CL = 35 pF 14 ATF1504ASV(L) 1409I-PLD-2/03 ATF1504ASV(L) Power-down Mode The ATF1504ASV(L) includes an optional pin-controlled power-down feature. When this mode is enabled, the PD pin acts as the power-down pin. When the PD pin is high, the device supply current is reduced to less than 3 mA. During power down, all output data and internal logic states are latched internally and held. Therefore, all registered and combinatorial output data remain valid. Any outputs that were in a High-Z state at the onset will remain at High-Z. During power down, all input signals except the power-down pin are blocked. Input and I/O hold latches remain active to ensure that pins do not float to indeterminate levels, further reducing system power. The power-down mode feature is enabled in the logic design file or as a fitted or translated s/w option. Designs using the power-down pin may not use the PD pin as a logic array input. However, all other PD pin macrocell resources may still be used, including the buried feedback and foldback product term array inputs. Power Down AC Characteristics(1)(2) -15 Symbol tIVDH tGVDH tCVDH tDHIX tDHGX tDHCX tDLIV tDLGV tDLCV tDLOV Notes: Parameter Valid I, I/O before PD High Valid OE (2) -20 Max Min 20 20 20 25 25 25 1 1 1 1 30 30 30 1 1 1 1 Max Units ns ns ns ns ns ns s s s s Min 15 15 15 before PD High Valid Clock(2) before PD High I, I/O Don't Care after PD High OE (2) Don't Care after PD High (2) Clock Don't Care after PD High PD Low to Valid I, I/O PD Low to Valid OE (Pin or Term) PD Low to Valid Clock (Pin or Term) PD Low to Valid Output 1. For slow slew outputs, add tSSO. 2. Pin or product term. 3. Includes tRPA for reduced-power bit enabled. 15 1409I-PLD-2/03 JTAG-BST/ISP Overview The JTAG boundary-scan testing is controlled by the Test Access Port (TAP) controller in the ATF1504ASV(L). The boundary-scan technique involves the inclusion of a shiftregister stage (contained in a boundary-scan cell) adjacent to each component so that signals at component boundaries can be controlled and observed using scan testing principles. Each input pin and I/O pin has its own boundary-scan cell (BSC) in order to support boundary-scan testing. The ATF1504ASV(L) does not currently include a Test Reset (TRST) input pin because the TAP controller is automatically reset at power-up. The five JTAG modes supported include: SAMPLE/PRELOAD, EXTEST, BYPASS, IDCODE and HIGHZ. The ATF1504ASV(L)'s ISP can be fully described using JTAG's BSDL as described in IEEE Standard 1149.1b. This allows ATF1504ASV(L) programming to be described and implemented using any one of the third-party development tools supporting this standard. The ATF1504ASV(L) has the option of using four JTAG-standard I/O pins for boundaryscan testing (BST) and in-system programming (ISP) purposes. The ATF1504ASV(L) is programmable through the four JTAG pins using the IEEE standard JTAG programming protocol established by IEEE Standard 1149.1 using 5V TTL-level programming signals from the ISP interface for in-system programming. The JTAG feature is a programmable option. If JTAG (BST or ISP) is not needed, then the four JTAG control pins are available as I/O pins. JTAG Boundary-scan Cell (BSC) Testing The ATF1504ASV(L) contains up to 68 I/O pins and four input pins, depending on the device type and package type selected. Each input pin and I/O pin has its own boundary-scan cell (BSC) in order to support boundary-scan testing as described in detail by IEEE Standard 1149.1. A typical BSC consists of three capture registers or scan registers and up to two update registers. There are two types of BSCs, one for input or I/O pin, and one for the macrocells. The BSCs in the device are chained together through the capture registers. Input to the capture register chain is fed in from the TDI pin while the output is directed to the TDO pin. Capture registers are used to capture active device data signals, to shift data in and out of the device and to load data into the update registers. Control signals are generated internally by the JTAG TAP controller. The BSC configuration for the input and I/O pins and macrocells are shown below. BSC Configuration for Input and I/O Pins (Except JTAG TAP Pins) Note: The ATF1504ASV(L) has pull-up option on TMS and TDI pins. This feature is selected as a design option. 16 ATF1504ASV(L) 1409I-PLD-2/03 ATF1504ASV(L) BSC Configuration for Macrocell Pin BSC TDO Pin 0 1 DQ Capture DR TDI Clock Shift TDO OEJ 0 0 1 1 DQ DQ OUTJ 0 0 1 1 DQ DQ Pin Capture DR TDI Shift Update DR Mode Clock Macrocell BSC 17 1409I-PLD-2/03 ATF1504ASV Dedicated Pinouts Dedicated Pin INPUT/OE2/GCLK2 INPUT/GCLR INPUT/OE1 INPUT/GCLK1 I/O /GCLK3 I/O / PD (1,2) I/O / TDI (JTAG) I/O / TMS (JTAG) I/O / TCK (JTAG) I/O / TDO (JTAG) GND VCC 44-lead TQFP 40 39 38 37 35 5, 19 1 7 26 32 4, 16, 24, 36 9, 17, 29, 41 44-lead J-lead 2 1 44 43 41 11, 25 7 13 32 38 10, 22, 30, 42 3, 15, 23, 35 68-lead J-lead 2 1 68 67 65 17, 37 12 19 50 57 6, 16, 26, 34, 38, 48, 58, 66 3, 11, 21, 31, 35, 43, 53, 63 84-lead J-lead 2 1 84 83 81 20, 46 14 23 62 71 7, 19, 32, 42, 47, 59, 72, 82 3,13, 26, 38, 43, 53, 66, 78 100-lead PQFP 92 91 90 89 87 14, 44 6 17 64 75 13, 28, 40, 45, 61, 76, 88, 97 5, 20, 36, 41, 53, 68, 84, 93 1, 2, 7, 9, 24, 26, 29, 30, 51, 52, 55, 57, 72, 74, 79, 80 68 64 100-lead TQFP 90 89 88 87 85 12, 42 4 15 62 73 11, 26, 38, 43, 59, 74, 86, 95 3, 18, 34, 39, 51, 66, 82, 91 1, 2, 5, 7, 22, 24, 27, 28, 49, 50, 53, 55, 70, 72, 77, 78 68 64 N/C - - - - # of Signal Pins # User I/O Pins 36 32 36 32 52 48 68 64 OE (1, 2) GCLR GCLK (1, 2, 3) PD (1, 2) TDI, TMS, TCK, TDO GND VCC Global OE pins Global Clear pin Global Clock pins Power-down pins JTAG pins used for boundary-scan testing or in-system programming Ground pins VCC pins for the device 18 ATF1504ASV(L) 1409I-PLD-2/03 ATF1504ASV(L) ATF1504ASV I/O Pinouts MC 1 2 3 4 5 6 7 8/ TDI 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32/ TMS PLC A A A/ PD1 A A A A A A A A A A A A A B B B B B B B B B B B B B B B B 44-lead 44-lead 68-lead 84-lead PLCC TQFP PLCC PLCC 12 11 9 8 7 6 5 4 21 20 19 18 17 16 14 13 6 5 3 2 1 44 43 42 15 14 13 12 11 10 8 7 18 17 15 14 13 12 10 9 8 7 5 4 33 32 30 29 28 27 25 24 23 22 20 19 22 21 20 18 17 16 15 14 12 11 10 9 8 6 5 4 41 40 39 37 36 35 34 33 31 30 29 28 27 25 24 23 100lead PQFP 16 15 14 12 11 10 8 6 4 3 100 99 98 96 95 94 39 38 37 35 34 33 32 31 27 25 23 22 21 19 18 17 100lead TQFP 14 13 12 10 9 8 6 4 100 99 98 97 96 94 93 92 37 36 35 33 32 31 30 29 25 23 21 20 19 17 16 15 MC 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48/ TCK 49 50 51 52 53 54 55 56/ TDO 57 58 59 60 61 62 63 64 PLC C C C/ PD2 C C C C C C C C C C C C C D D D D D D D D D D D D D D D D/ GCLK3 44-lead 44-lead 68-lead 84-lead PLCC TQFP PLCC PLCC 24 25 26 27 28 29 31 32 33 34 36 37 38 39 40 41 18 19 20 21 22 23 25 26 27 28 30 31 32 33 34 35 36 37 39 40 41 42 44 45 46 47 49 50 51 52 54 55 56 57 59 60 61 62 64 65 44 45 46 48 49 50 51 52 54 55 56 57 58 60 61 62 63 64 65 67 68 69 70 71 73 74 75 76 77 79 80 81 100lead PQFP 42 43 44 46 47 48 49 50 54 56 58 59 60 62 63 64 65 66 67 69 70 71 73 75 77 78 81 82 83 85 86 87 100lead TQFP 40 41 42 44 45 46 47 48 52 54 56 57 58 60 61 62 63 64 65 67 68 69 71 73 75 76 79 80 81 83 84 85 19 1409I-PLD-2/03 SUPPLY CURRENT VS. SUPPLY VOLTAGE (TA = 25C, F = 0) 100 SUPPLY CURRENT VS. FREQUENCY LOW-POWER ("L") VERSION (TA = 25C) 100.0 75 STANDARD POWER ICC (mA) 80.0 STANDARD POWER ICC (mA) 60.0 40.0 REDUCED POWER 20.0 50 REDUCED POWER MODE 25 0 2.50 2.75 3.00 3.25 3.50 3.75 4.00 0.0 0.00 5.00 10.00 FREQUENCY (MHz) 15.00 20.00 SUPPLY VOLTAGE (V) 800 SUPPLY CURRENT VS. SUPPLY VOLTAGE PIN-CONTROLLED POWER-DOWN MODE (TA = 25C, F = 0) 0 -2 OUTPUT SOURCE CURRENT VS. SUPPLY VOLTAGE (VOH = 2.4V, TA = 25C) 700 IOH (mA) -4 STANDARD & REDUCED POWER MODE ICC (uA) 600 -6 -8 -10 -12 -14 500 400 2.50 2.75 3.00 3.25 3.50 3.75 4.00 -16 2.75 3.00 3.25 3.50 3.75 4.00 SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) SUPPLY CURRENT VS. FREQUENCY STANDARD POWER (TA = 25C) 150.0 125.0 IOH (mA) 10 0 -10 OUTPUT SOURCE CURRENT VS. OUTPUT VOLTAGE (VCC = 3.3V, TA = 25C) 100.0 ICC (mA) 75.0 50.0 25.0 0.0 0.00 STANDARD POWER -20 -30 -40 -50 -60 -70 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 REDUCED POWER MODE 20.00 40.00 60.00 80.00 100.00 OUTPUT VOLTAGE (V) FREQUENCY (MHz) SUPPLY CURRENT VS. SUPPLY VOLTAGE LOW-POWER ("L") VERSION (TA = 25C, F = 0) 25 OUTPUT SINK CURRENT VS. SUPPLY VOLTAGE (VOL = 0.5V, TA = 25C) 40 35 20 IOL (mA) ICC (uA) 15 10 5 0 2.50 30 25 20 2.75 2.75 3.00 3.25 3.50 3.75 4.00 3.00 3.25 3.50 3.75 4.00 SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) 20 ATF1504ASV(L) 1409I-PLD-2/03 ATF1504ASV(L) OUTPUT SINK CURRENT VS. OUTPUT VOLTAGE (VCC = 3.3V, TA = 25C) 100 80 60 40 20 0 0 0.5 1 1.5 2 2.5 3 3.5 4 15 10 5 0 -5 -10 0 INPUT CURRENT VS. INPUT VOLTAGE (VCC = 3.3V, TA = 25C) INPUT CURRENT (uA) IOL (mA) 0.5 1 1.5 2 2.5 3 3.5 OUTPUT VOLTAGE (V) INPUT VOLTAGE (V) INPUT CLAMP CURRENT VS. INPUT VOLTAGE (VCC = 3.3V, TA = 25C) 0 -20 -40 -60 -80 -100 -1 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 INPUT CURRENT (mA) INPUT VOLTAGE (V) 21 1409I-PLD-2/03 ATF1504ASV(L) Ordering Information tPD (ns) 15 tCO1 (ns) 8 fMAX (MHz) 100 Ordering Code ATF1504ASV-15 AC44 ATF1504ASV-15 JC44 ATF1504ASV-15 JC68 ATF1504ASV-15 JC84 ATF1504ASV-15 QC100 ATF1500ASV-15 AC100 ATF1504ASV-15 AI44 ATF1504ASV-15 JI44 ATF1504ASV-15 JI68 ATF1504ASV-15 JI84 ATF1504ASV-15 QI100 ATF1504ASV-15 AI100 ATF1504ASVL-20 AC44 ATF1504ASVL-20 JC44 ATF1504ASVL-20 JC68 ATF1504ASVL-20 JC84 ATF1504ASVL-20 QC100 ATF1504ASVL-20 AC100 ATF1504ASVL-20 AI44 ATF1504ASVL-20 JI44 ATF1504ASVL-20 JI68 ATF1504ASVL-20 JI84 ATF1504ASVL-20 QI100 ATF1504ASVL-20 AI100 Package 44A 44J 68J 84J 100Q1 100A 44A 44J 68J 84J 100Q1 100A 44A 44J 68J 84J 100Q1 100A 44A 44J 68J 84J 100Q1 100A Operation Range Commercial (0C to 70C) 15 8 100 Industrial (-40C to +85C) 20 12 83.3 Commercial (0C to 70C) 20 12 83.3 Industrial (-40C to +85C) Using "C" Product for Industrial There is very little risk in using "C" devices for industrial applications because the VCC conditions for 3.3V products are the same for commercial and industrial (there is only 15C difference at the high end of the temperature range). To use commercial product for industrial temperature ranges, de-rate ICC by 15%. 22 ATF1504ASV(L) 1409I-PLD-2/03 ATF1504ASV(L) Packaging Information 44A - TQFP PIN 1 B PIN 1 IDENTIFIER e E1 E D1 D C 0~7 A1 L COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL A A1 A2 D D1 E MIN - 0.05 0.95 11.75 9.90 11.75 9.90 0.30 0.09 0.45 NOM - - 1.00 12.00 10.00 12.00 10.00 - - - 0.80 TYP MAX 1.20 0.15 1.05 12.25 10.10 12.25 10.10 0.45 0.20 0.75 Note 2 Note 2 NOTE A2 A Notes: 1. This package conforms to JEDEC reference MS-026, Variation ACB. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.10 mm maximum. E1 B C L e 10/5/2001 2325 Orchard Parkway San Jose, CA 95131 TITLE 44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness, 0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) DRAWING NO. 44A REV. B R 23 1409I-PLD-2/03 44J - PLCC 1.14(0.045) X 45 PIN NO. 1 IDENTIFIER 1.14(0.045) X 45 0.318(0.0125) 0.191(0.0075) E1 B E B1 D2/E2 e D1 D A A2 A1 0.51(0.020)MAX 45 MAX (3X) COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL A A1 A2 D D1 E Notes: 1. This package conforms to JEDEC reference MS-018, Variation AC. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line. 3. Lead coplanarity is 0.004" (0.102 mm) maximum. E1 D2/E2 B B1 e MIN 4.191 2.286 0.508 17.399 16.510 17.399 16.510 14.986 0.660 0.330 NOM - - - - - - - - - - 1.270 TYP MAX 4.572 3.048 - 17.653 16.662 17.653 16.662 16.002 0.813 0.533 Note 2 Note 2 NOTE 10/04/01 2325 Orchard Parkway San Jose, CA 95131 TITLE 44J, 44-lead, Plastic J-leaded Chip Carrier (PLCC) DRAWING NO. 44J REV. B R 24 ATF1504ASV(L) 1409I-PLD-2/03 ATF1504ASV(L) 68J - PLCC 1.14(0.045) X 45 PIN NO. 1 IDENTIFIER 1.14(0.045) X 45 0.318(0.0125) 0.191(0.0075) E1 B E B1 D2/E2 e D1 D A A2 A1 0.51(0.020)MAX 45 MAX (3X) COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL A A1 A2 D D1 E Notes: 1. This package conforms to JEDEC reference MS-018, Variation AE. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line. 3. Lead coplanarity is 0.004" (0.102 mm) maximum. E1 D2/E2 B B1 e MIN 4.191 2.286 0.508 25.019 24.130 25.019 24.130 22.606 0.660 0.330 NOM - - - - - - - - - - 1.270 TYP MAX 4.572 3.048 - 25.273 24.333 25.273 24.333 23.622 0.813 0.533 Note 2 Note 2 NOTE 10/04/01 2325 Orchard Parkway San Jose, CA 95131 TITLE 68J, 68-lead, Plastic J-leaded Chip Carrier (PLCC) DRAWING NO. 68J REV. B R 25 1409I-PLD-2/03 84J - PLCC 1.14(0.045) X 45 PIN NO. 1 IDENTIFIER 1.14(0.045) X 45 0.318(0.0125) 0.191(0.0075) E1 B E B1 D2/E2 e D1 D A A2 A1 0.51(0.020)MAX 45 MAX (3X) COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL A A1 A2 D D1 E Notes: 1. This package conforms to JEDEC reference MS-018, Variation AF. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line. 3. Lead coplanarity is 0.004" (0.102 mm) maximum. E1 D2/E2 B B1 e MIN 4.191 2.286 0.508 30.099 29.210 30.099 29.210 27.686 0.660 0.330 NOM - - - - - - - - - - 1.270 TYP MAX 4.572 3.048 - 30.353 29.413 30.353 29.413 28.702 0.813 0.533 Note 2 Note 2 NOTE 10/04/01 2325 Orchard Parkway San Jose, CA 95131 TITLE 84J, 84-lead, Plastic J-leaded Chip Carrier (PLCC) DRAWING NO. 84J REV. B R 26 ATF1504ASV(L) 1409I-PLD-2/03 ATF1504ASV(L) 100Q1 - PQFP Dimensions in Millimeters and (Inches)* *Controlling dimensions: millimeters JEDEC STANDARD MS-022, GC-1 PIN 1 ID 17.45 (0.687) 16.95 (0.667) PIN 1 0.65 (0.0256) BSC 0.40 (0.016) 0.22 (0.009) 20.10 (0.791) 19.90 (0.783) 23.45 (0.923) 22.95 (0.904) 14.12 (0.556) 13.90 (0.547) 0.23 (0.009) 0.11 (0.004) 0~7 1.03 (0.041) 0.73 (0.029) 3.40 (0.134) MAX 0.50 (0.020) 0.25 (0.010) 04/11/2001 DRAWING NO. TITLE 2325 Orchard Parkway 100Q1, 100-lead, 14 x 20 mm Body, 3.2 mm Footprint, 0.65 mm Pitch, 100Q1 San Jose, CA 95131 Plastic Quad Flat Package (PQFP) REV. A R 27 1409I-PLD-2/03 100A - TQFP PIN 1 B PIN 1 IDENTIFIER e E1 E D1 D C 0~7 A1 L COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL A A1 A2 D D1 E MIN - 0.05 0.95 15.75 13.90 15.75 13.90 0.17 0.09 0.45 NOM - - 1.00 16.00 14.00 16.00 14.00 - - - 0.50 TYP MAX 1.20 0.15 1.05 16.25 14.10 16.25 14.10 0.27 0.20 0.75 Note 2 Note 2 NOTE A2 A Notes: 1. This package conforms to JEDEC reference MS-026, Variation AED. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.08 mm maximum. E1 B C L e 10/5/2001 2325 Orchard Parkway San Jose, CA 95131 TITLE 100A, 100-lead, 14 x 14 mm Body Size, 1.0 mm Body Thickness, 0.5 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) DRAWING NO. 100A REV. C R 28 ATF1504ASV(L) 1409I-PLD-2/03 Atmel Headquarters Corporate Headquarters 2325 Orchard Parkway San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 487-2600 Atmel Operations Memory 2325 Orchard Parkway San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 436-4314 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany TEL (49) 71-31-67-0 FAX (49) 71-31-67-2340 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TEL 1(719) 576-3300 FAX 1(719) 540-1759 Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland TEL (41) 26-426-5555 FAX (41) 26-426-5500 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France TEL (33) 2-40-18-18-18 FAX (33) 2-40-18-19-60 Biometrics/Imaging/Hi-Rel MPU/ High Speed Converters/RF Datacom Avenue de Rochepleine BP 123 38521 Saint-Egreve Cedex, France TEL (33) 4-76-58-30-00 FAX (33) 4-76-58-34-80 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong TEL (852) 2721-9778 FAX (852) 2722-1369 ASIC/ASSP/Smart Cards Zone Industrielle 13106 Rousset Cedex, France TEL (33) 4-42-53-60-00 FAX (33) 4-42-53-60-01 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TEL 1(719) 576-3300 FAX 1(719) 540-1759 Scottish Enterprise Technology Park Maxwell Building East Kilbride G75 0QR, Scotland TEL (44) 1355-803-000 FAX (44) 1355-242-743 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan TEL (81) 3-3523-3551 FAX (81) 3-3523-7581 literature@atmel.com Web Site http://www.atmel.com (c) Atmel Corporation 2003. Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company's standard warranty which is detailed in Atmel's Terms and Conditions located on the Company's web site. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel's products are not authorized for use as critical components in life support devices or systems. Atmel (R) is the registered trademark of Atmel. Other terms and product names may be the trademarks of others. Printed on recycled paper. 1409I-PLD-2/03 xM |
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